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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of epoxy and rubber addition on die attach films (DAFs) materials properties

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Choi, Y / Jang, KW / Chung, CK / Lee S. / Paik, Kyung-Wookresearcher
Publisher
123
Issue Date
2009-05-26
Language
English
Citation

59th Electronic Components and Technology Conference, ECTC 2009, pp.1525 - 1530

URI
http://hdl.handle.net/10203/154254
Appears in Collection
MS-Conference Papers(학술회의논문)
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