DSpace at KOASAS: Multiple Flip-chip Assembly for Hybrid Compact Optoelectronic Modules using Electroplated AuSn Solder Bumps

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Multiple Flip-chip Assembly for Hybrid Compact Optoelectronic Modules using Electroplated AuSn Solder Bumps

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Jeon, Duk Young researcher / Chu, KM / Lee, JS / Oppermann, H / Engelmann, G / Wolf, J / Reichl, H

Issue Date: 2006

Language: ENG

Citation: IMAPS 2006 (39th International Symposium on Microelectronics 2006), pp.653 -

URI: http://hdl.handle.net/10203/150532

Appears in Collection: MS-Conference Papers(학술회의논문)

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