Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications
- Publisher
- IEEE
- Issue Date
- 2003-05-27
- Language
- ENG
- Citation
53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- FC_80.pdf(534.64 kB)Download
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