T Peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가(Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test)

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dc.contributor.author유진-
dc.contributor.authorSong, JY-
dc.date.accessioned2013-03-16T19:30:08Z-
dc.date.available2013-03-16T19:30:08Z-
dc.date.created2012-02-06-
dc.date.issued2000-
dc.identifier.citationIMAPS Korea 2000 , Fall Symp. Dankuk Univ., v., no., pp.107 - 111-
dc.identifier.urihttp://hdl.handle.net/10203/134953-
dc.languageKOR-
dc.titleT Peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가(Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test)-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage107-
dc.citation.endingpage111-
dc.citation.publicationnameIMAPS Korea 2000 , Fall Symp. Dankuk Univ.-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthor유진-
dc.contributor.nonIdAuthorSong, JY-
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MS-Conference Papers(학술회의논문)
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