Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Conference

Showing results 5061 to 5080 of 15764

5061
Flexible photonic sensor based on locally synthesized metal oxide nanowire network

Yang D.; Park, Inkyu, 2010 10th IEEE Conference on Nanotechnology, NANO 2010, pp.744 - 748, 2010-08-17

5062
Flexible piezocapacitive force sensor based on sponge-like elastomer

권동욱; 이태익; 김승환; 김민성; 김택수; 박인규, The Korean Sensors Society Conference 2015, 한국센서학회, 2015-11

5063
Flexible Pressure Sensor Based on Porous Dielectric Elastomer Containing Conductive Filler

Choi, Jungrak; Kim, Kyuyoung; Oh, Yongsuk; Park, Inkyu, 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019, pp.830 - 832, IEEE, 2019-01-29

5064
Flexible Pressure Sensor Based on Porous Elastomer Containing Conductive Filler for Wearable Applications

최중락; 박인규, 마이크로 나노 시스템학회 (KMEMS) 2019, 마이크로나노시스템학회, 2019-04-05

5065
Flexible Pressure Sensor Based on Porous Elastomer Containing Conductive Filler for Wearable Applications

최중락; 박인규, 2019 대한기계학회 마이크로나노분과, 대한기계학회, 2019-05-23

5066
Flexible Ring Flapping in a Uniform flow

Kim, Bo Young; Sung, Hyung Jin, 2013 SIAM Conference on Computational Science & Engineering, 2013 SIAM Conference on Computational Science & Engineering, 2013-02-26

5067
Flexible Rotor System Identification and Vibration Control by Using a Magnetic Bearing

Kim, J.S.; Lee, Chong-Won, Third International Symposium on Magnetic Bearings, 1992-07

5068
Flexible strain sensor using optical transmittance change for wearable applications

구지민; 권동욱; 안준성; 박인규, 2018 한국생산제조학회 춘계학술대회, 한국생산제조학회, 2018-05

5069
Flexible Wearable Device Application by Laser-Induced Graphene Direct Writing on Kevlar Textile

Yang, Dongwook; Nam, Han Ku; Le, Truong-Son Dinh; Lee, Younggeun; Kim, Young-Ryeul; Kim, Seung-Woo; KIM, Young-Jin, The 2nd International Conference on Design for 3D Printing, ICD3DP 2023, KSME, NTU 3D Printing singapore center, 2023-10-19

5070
Flexible-linker embedded polymer donors enable superior blend miscibility for high-performance and mechanically-robust polymer solar cells

Lee, Jin-Woo; Jung, Dahyun; Kim, Dong Jun; Kim, Taek-Soo; Kim, Bumjoon J., ACS Spring 2022, American Chemical Society, 2022-03-20

5071
Flexing Effects on the Accelerated Life Testing of Hydraulic Hose

백동춘; 이순복; 강보식; 김형의, KSME Reliability Division Conference, 2008

5072
Flexural Modulus Measurement and Warpage Analysis of Multilayers on Polymer Composite Substrates for Flexible Electronics

Lee, TI; Kim, C; Kim, MS; Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16

5073
Flexure hinge mechanism having amplified rectilinear motion for confocal scanning microscopy using optical section

Seo, J.W.; Kang, D.K.; Shim, J.Y.; Jeong, JH; Gweon, Dae-Gab, International conference on control, Automation and Systems 2001, pp.1564 - 1567, 2001-10

5074
Flip-chip alignment with a dual imaging system using a visual servoing method

Lee D.; Tao X.; Cho, Hyungsuck; Cho Y., Optomechatronic Systems Control, v.6052, pp.605203-1 - 605203-12, International Society for Optical Engineering (SPIE), 2005-12-05

5075
Flipped Learning PBL of NTU and KAIST for 4IR Innovator

윤용진, [ACE+] 2019 Inha Innovative education Symposium, 인하대학교 교수학습개발센터, 2019-11-08

5076
Floating Transfer of Residual-Free Graphene using Water Surface

J. Seo; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-15

5077
Floor-types identification method for wheel robot using impedance variation

Lee E.C.; Choi H.D.; Kim S.H.; Kwak, Yoon Keun, 2008 International Conference on Control, Automation and Systems, ICCAS 2008, pp.2340 - 2343, 2008-10-14

5078
Flow analysis in micro-channel by a fringe element reconstruction method

Choi,D.S; Im, Yong-Taek, International Conference on Computational Methods, pp.135 -, Hiroshima University, 2007-04-04

5079
Flow Analysis of Compression Molded SMC

Lee, L.J; Kim, J; Fan, J.D; Im, Yong-Taek, RETEC, pp.313 - 316, 1987

5080
Flow Analysis of Polymeric Materials in Compression Molding

Im, Yong-Taek; Fan, J.D; Lee, L.J, Materials in Manufacturing Processes, MD-8,ASME Winter Annual Meeting, pp.93 - 100, 1988-12

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