Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject DELAMINATION

Showing results 1 to 11 of 11

1
BOUNDARY-LAYERS IN WEDGES OF LAMINATED COMPOSITE STRIPS UNDER GENERALIZED PLANE DEFORMATION .1. ASYMPTOTIC SOLUTIONS

KIM, TW; Im, Seyoung, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.32, no.5, pp.609 - 628, 1995-03

2
BOUNDARY-LAYERS IN WEDGES OF LAMINATED COMPOSITE STRIPS UNDER GENERALIZED PLANE DEFORMATION .2. COMPLETE NUMERICAL-SOLUTIONS

KIM, TW; Im, Seyoung, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.32, no.5, pp.629 - 645, 1995-03

3
Continuum mechanics based beam elements for linear and nonlinear analyses of multi-layered composite beams with interlayer slips

Kim, Hyo-Jin; Yoon, Kyungho; Lee, Phill-Seung, COMPOSITE STRUCTURES, v.235, 2020-03

4
FINITE-ELEMENT ANALYSIS OF A SUBSURFACE CRACK ON THE INTERFACE OF A COATED MATERIAL UNDER A MOVING COMPRESSIVE LOAD

LEE, KS; JINN, JT; Earmme, Youn-Young, WEAR, v.155, no.1, pp.117 - 136, 1992-05

5
Modeling of a Gc-sensing element for the interfacial toughness of metal thin films on substrates

Jeon I.; Asahina T.; Omiya M.; Kishimoto K.; Im, Seyoung, SENSORS AND ACTUATORS A-PHYSICAL, v.122, no.2, pp.291 - 300, 2005-08

6
Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump

Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03

7
Moisture induced interface weakening in ACF package

Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12

8
Multifunctionality and control of the crumpling and unfolding of large-area graphene

Zang, Jianfeng; Ryu, Seunghwa; Pugno, Nicola; Wang, Qiming; Tu, Qing; Buehler, Markus J.; Zhao, Xuanhe, NATURE MATERIALS, v.12, no.4, pp.321 - 325, 2013-04

9
Recent developments in the manufacturing technologies of composite components and their cost-effectiveness in the automotive industry: A review study

SARFRAZ MUHAMMAD SALMAN; Hong, Hyunsoo; Kim, Seong Su, COMPOSITE STRUCTURES, v.266, 2021-06

10
Role of Crack Deflection on Rate Dependent Mechanical Transfer of Multilayer Graphene and Its Application to Transparent Electrodes

Kang, Sumin; Yoon, Taeshik; Kim, Seunghwan; Kim, Taek-Soo, ACS APPLIED NANO MATERIALS, v.2, no.4, pp.1980 - 1985, 2019-04

11
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

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