Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject BUMP

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Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

Lee, Jong-Bum; Koo, Ja-Myeong; Hong, Soon-Min; Shin, Hyoyoung; Moon, Youn-jin; Jung, Jae-Pil; Yoo, Choon-Donresearcher; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.5, pp.4300 - 4304, 2008-05

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