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Photocrosslinkable liquid prepolymers for flexible waveguide display applications Park, Seung Koo; Ju, Jung Jin; Kim, Jin Tae; Kim, Min-su; Moon, Jaehyun; Lee, Jeong-Ik; Chu, Hye Yong; et al, JOURNAL OF MATERIALS CHEMISTRY C, v.1, no.17, pp.2983 - 2989, 2013 |
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02 |
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