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Showing results 1 to 6 of 6

1
Copper Interconnects Based on Copper(I) Oxide Particle-Based Precursor Ink Technology-Material Composition Optimization and Reliability

Lee, Hu Seung; Yang, Minyang, IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, v.16, no.4, pp.604 - 609, 2016-12

2
Digital-Mode Organic Vapor-Jet Printing (D-OVJP): Advanced Jet-on-Demand Control of Organic Thin-Film Deposition

Yun, Chang-Hun; Choi, Jung-Min; Kang, Hyun-Wook; Kim, Min-Cheol; Moon, Han-Ul; Sung, Hyung-Jin; Yoo, Seung-Hyup, ADVANCED MATERIALS, v.24, no.21, pp.2857 - 2862, 2012-06

3
Direct Laser Writing of Graphene-Based Electrical Interconnects for Printed Circuit Board Repair

Lim, Chin Huat Joel; Suchand Sandeep, C. S.; Murukeshan, Vadakke Matham; Kim, Young-Jin, ADVANCED MATERIALS TECHNOLOGIES, v.6, no.12, 2021-12

4
Effect of micro surface structure on printing = 미세표면구조가 전자 인쇄에 미치는 영향에 관한 연구link

Kim, Seung-Hwan; 김승환; et al, 한국과학기술원, 2010

5
Effect of printing parameters on gravure patterning with conductive silver ink

Kim, Seung-hwan; Sung, Hyung-Jin, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.25, no.4, 2015-04

6
Liquid transfer between two separating plates for conductive material patterning = 전도성 물질 패터닝을 위한 두 평면간의 유체 전이에 관한 연구link

Kang, Hyun-Wook; 강현욱; et al, 한국과학기술원, 2009

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