Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject delamination

Showing results 1 to 7 of 7

1
A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry

Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03

2
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

3
Delamination Characteristics of Single Layer and Stacked HTS Coated Conductor for Conduction Cooling Application

Park, Heecheol; Jung, Hwanjun; Kim, Seokho; Park, Minwon; Lee, Sangjin; Ha, Hong-soo; Moon, Seung-Hyun; et al, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.23, no.3, 2013-06

4
Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process

Yoon, Tae-Shik; Shin, Woo-Cheol; Kim, Taek-Yong; Mun, Jeong-Hun; Kim, Taek-Sooresearcher; Cho, Byung-Jinresearcher, NANO LETTERS, v.12, no.3, pp.1448 - 1452, 2012-03

5
Foreign objects impact damage characteristics of aluminum/composite hybrid drive shaft

Kim, HS; Kim, BC; Lim, TS; Lee, Dai Gilresearcher, COMPOSITE STRUCTURES, v.66, no.1-4, pp.377 - 389, 2004-10

6
Impact characteristics of glass fiber composites with respect to fiber volume fraction

Lee, Dai Gilresearcher; Cheon, SS, JOURNAL OF COMPOSITE MATERIALS, v.35, no.1, pp.27 - 56, 2001

7
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Kwon, WS; Yim, MJ; Paik, Kyung-Wookresearcher; Ham, SJ; Lee, Soon-Bokresearcher, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06

Discover

Type

. next

Open Access

Date issued

Subject

. next

rss_1.0 rss_2.0 atom_1.0