Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject damage model

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Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

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