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Analysis of dielectric sensors for the cure monitoring of resin matrix composite materials Kim, JS; Lee, Dai Gil, SENSORS AND ACTUATORS B-CHEMICAL, v.30, no.2, pp.159 - 164, 1996-01 |
Development of the simple dielectric sensor for the cure monitoring of the high temperature composites Choi, JH; Kim, IY; Lee, Dai Gil, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.132, no.1-3, pp.168 - 176, 2003-01 |
Dielectric cure monitoring for glass/polyester prepreg composites Kim, HG; Lee, Dai Gil, COMPOSITE STRUCTURES, v.57, no.1-4, pp.91 - 99, 2002-07 |
Dielectric-piezoelectric 특성을 이용한 접착 조인트의 경화 및 reliability 모니터링에 관한 연구 = Cure and reliability monitoring for adhesively bonded joints by dielectric and piezoelectric methodlink 권재욱; Kwon, Jae-Wook; et al, 한국과학기술원, 2002 |
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