Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject DELAMINATION

Showing results 1 to 9 of 9

1
BOUNDARY-LAYERS IN WEDGES OF LAMINATED COMPOSITE STRIPS UNDER GENERALIZED PLANE DEFORMATION .1. ASYMPTOTIC SOLUTIONS

KIM, TW; Im, Seyoungresearcher, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.32, no.5, pp.609 - 628, 1995-03

2
BOUNDARY-LAYERS IN WEDGES OF LAMINATED COMPOSITE STRIPS UNDER GENERALIZED PLANE DEFORMATION .2. COMPLETE NUMERICAL-SOLUTIONS

KIM, TW; Im, Seyoungresearcher, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.32, no.5, pp.629 - 645, 1995-03

3
FINITE-ELEMENT ANALYSIS OF A SUBSURFACE CRACK ON THE INTERFACE OF A COATED MATERIAL UNDER A MOVING COMPRESSIVE LOAD

LEE, KS; JINN, JT; Earmme, Youn-Youngresearcher, WEAR, v.155, no.1, pp.117 - 136, 1992-05

4
Modeling of a Gc-sensing element for the interfacial toughness of metal thin films on substrates

Jeon I.; Asahina T.; Omiya M.; Kishimoto K.; Im, Seyoungresearcher, SENSORS AND ACTUATORS A-PHYSICAL, v.122, no.2, pp.291 - 300, 2005-08

5
Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump

Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03

6
Moisture induced interface weakening in ACF package

Sim, Gidongresearcher; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12

7
Multifunctionality and control of the crumpling and unfolding of large-area graphene

Zang, Jianfeng; Ryu, Seunghwaresearcher; Pugno, Nicola; Wang, Qiming; Tu, Qing; Buehler, Markus J.; Zhao, Xuanhe, NATURE MATERIALS, v.12, no.4, pp.321 - 325, 2013-04

8
Role of Crack Deflection on Rate Dependent Mechanical Transfer of Multilayer Graphene and Its Application to Transparent Electrodes

Kang, Sumin; Yoon, Taeshik; Kim, Seunghwan; Kim, Taek-Sooresearcher, ACS APPLIED NANO MATERIALS, v.2, no.4, pp.1980 - 1985, 2019-04

9
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

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