Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject BUMP

Showing results 1 to 2 of 2

1
Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics

Jo, Jung-Lae; Lee, Jong-Bum; Lee, Jong-Gun; Jeon, Sung-Ho; Kim, Jong-Min; Shin, Young-Eui; Moon, Jeong-Hoon; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.7, pp.07GA01 - 07GA04, 2009-07

2
Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

Lee, Jong-Bum; Koo, Ja-Myeong; Hong, Soon-Min; Shin, Hyoyoung; Moon, Youn-jin; Jung, Jae-Pil; Yoo, Choon-Donresearcher; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.5, pp.4300 - 4304, 2008-05

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