Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates

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Spiral inductors were fabricated by burying thick metals in radio frequency (RF) package substrates. The inductors consist of a 40-mu m-thick copper spiral buried in an anodized aluminum substrate and an overpass supported by a benzocyclobutene layer on top of the substrate. Due to their low ohmic loss, significantly high Q factors were obtained at 2 GHz: a Q factor of over 100 with 4.2-nH inductance (2.5-turn spiral) and a Q of 60 with 7.8-nH inductance (3.5-turn). The results demonstrate that the substrate-buried thick metal process can be a viable technique to meet the demands on cost-effective high-Q inductors compatible with conventional thin-film processes for RF integrated circuits.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2012-08
Language
English
Article Type
Article
Keywords

SPIRAL INDUCTORS

Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264

ISSN
2156-3950
DOI
10.1109/TCPMT.2011.2180905
URI
http://hdl.handle.net/10203/102335
Appears in Collection
EE-Journal Papers(저널논문)
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