Showing results 195641 to 195660 of 275595
An improved HLLE method for hypersonic viscous flows Park, S.H.; Kwon, Jang-Hyuk, AIAA CFD Conference, pp.733 - 743, AIAA, 2001-06 |
Thermopiezoelastic snapping of piezolaminated plates using layerwise nonlinear finite elements Oh, Il-Kwon; Han, Jae-Hung; Lee, In, AIAA JOURNAL, v.39, no.6, pp.1188 - 1197, 2001-06 |
The protective effect of Amomum xanthoides extract against alloxan-induced diabetes through the suppression of NFκB activation Park, BH; Park, JW, EXPERIMENTAL AND MOLECULAR MEDICINE, v.33, no.2, pp.64 - 68, 2001-06 |
Microwave frequency model of water level package and increased loading effect on rambus memory module Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29 |
Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
Selective infiltration manufacturing method and apparatus to fabricate prototypes and moulds by infiltrating molten droplets selectively into layers of powder 양동열, 2001-05-29 |
Sealed high-density on-line measuring device 장용근, 2001-05-29 |
Cache replacement schemes for data-driven label switching networks Kim, N.; Jean, S.; Kim, J.; Yoon, Hyunsoo, 2001 IEEE Workshop on High Performance Switching and Routing, pp.223 - 227, IEEE, 2001-05-29 |
Over GHz low-power RF clock distribution for a multiprocessor digital system Ryu, W.; Lu, A.; Wai, C.; Wei, F.; Lai, W.L.; Kim, Joungho, 51st Electronic Components and Technology Conference, pp.133 - 140, ECTC, 2001-05-29 |
Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.950 - 956, Electronic Components and Technology Conference, 2001-05-29 |
Relationships between suspension formulations and the properties of BaTiO3/epoxy composite films for integral capacitors Cho, SD; Paik, Kyung-Wook, 51st 2001 Electronic Components and Technology Conference, pp.1418 - 1422, IEEE, 2001-05-29 |
Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads Nah, JW; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.790 - 795, IEEE, 2001-05-29 |
The kinetics of lithium transport through Li1-δCoO2 thin film electrode by theoretical analysis of current transient and cyclic voltammogram Pyun, Su Il; Shin H.-C., 10th International Meeting on Lithium Batteries, pp.277 - 281, 2001-05-28 |
The kinetics of lithium transport through vanadium pentoxide composite and film electrodes by current transient analysis Pyun, Su Il; Lee M.-H.; Shin H.-C., 10th International Meeting on Lithium Batteries, pp.473 - 477, 2001-05-28 |
Electrochemical characteristics of polymer electrolytes based on P(VdF-co-HFP)/PMMA ionomer blend for PLIB Lee, YG; Park, Jung-Ki, 10th International Meeting on Lithium Batteries, pp.616 - 620, 2001-05-28 |
Active thermal stabilization of machine structure using the fixed temperature point of gallium Kim, Seung-Woo, Proc. of 2nd Euspen International Conference, pp.824 - 827, 2001-05-27 |
A set-oriented genetic algorithm and the knapsack problem Ku S.; Lee B., Congress on Evolutionary Computation 2001, v.1, pp.650 - 654, 2001-05-27 |
Influence of Periodic Suction/Blowing on a Turbulent Boundary Layer Park, Y.S.; Park, S.H.; Sung, Hyung Jin, 6th Asian Symposium on Visualization, 2001-05-27 |
Pressure drop and heat transfer characteristics of flow boiling in small rectangular horizontal channels Lee, HJ; Lee, Sang Yong, 4th International Conference on Multiphase Flow, 2001-05-27 |
Hybrid parallel evolutionary algorithms for constrained optimization utilizing PC clustering Lee, C.-H.; Park, K.-H.; Kim, Jong-Hwan, Congress on Evolutionary Computation 2001, pp.1436 - 1441, IEEE, 2001-05-27 |
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