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Showing results 172801 to 172820 of 225369


WallTop: Managing Overflowing Windows on a Large Display

Bi, Xiaojun; Bae, Seok-Hyungresearcher; Balakrishnan, Ravin, HUMAN-COMPUTER INTERACTION, v.29, no.2, pp.153 - 203, 2014-03


WALRUS: A Similarity Retrieval Algorithm for Image Databases

Shim Kyuseokresearcher, ACM SIGMOD International Conference on Management of Data, 1999


Walther Nernst and the transition to modern physical science.

Park, Buhm Soonresearcher, ANNALS OF SCIENCE, v.58, no.4, pp.434 - 435, 2001-10


Wankel 엔진의 에이펙스 시일 파손과 엔진 이상 폭발과의 관계

김승수researcher, 한국자동차공학회지, v.7, no.1, 1985


Want to speak? Envisioning driver-to-driver communication for emotion regulation

Kim, Haechan; Kim, Do-Hyeong; Lee, Kun-Pyoresearcher, 10th International Conference on Design & Emotion, Design & Emotion, 2016-09-27


Wapee: A fault-tolerant semantic middleware in ubiquitous computing environments

Kim, Yoon-Hee; Kim, Eun-Kyung; Jeon, Beom-Jun; Ko, In-Youngresearcher; Park, Sung-Yong, EMERGING DIRECTIONS IN EMBEDDED AND UBIQUITOUS COMPUTING BOOK SERIES: LECTURE NOTES IN COMPUTER SCIENCE, v.4097, pp.173 - 182, 2006


WAPK, a Ser/Thr protein kinase gene of Nicotiana tabacum, is uniquely regulated by wounding, abscisic acid and methyl jasmonate

Chung, Won Ilresearcher, MOLECULAR AND GENERAL GENETICS, v.259, no.5, pp.516 - 522, 1998


War Room Approach Based on Analysis of VOC

Park, Sang Chan, 2nd Bilateral Korea-China Quality Management Symposium, pp.301 - 319, 2002


Waring's problem for rational functions

Im, Bo-Haeresearcher, KMS-DMV Joint Conference, Korean Mathematical Society, 2018-10-04


Warm white LEDs에 적용을 위한 3색 발광 $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ 형광체의 합성 및 발광 특성 연구 = Synthesis of tunable full color emitting $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ phosphor for the application to warm white LEDs and its characterizationlink

원유호; Won, Yu-Ho; et al, 한국과학기술원, 2006


Warming Up Your Tick-Tock: Temperature-Dependent Regulation of Circadian Clocks

Ki, Yoonhee; Ri, Hwajung; Lee, Hoyeon; Yoo, Eunseok; Choe, Joonhoresearcher; Lim, Chunghun, NEUROSCIENTIST, v.21, no.5, pp.503 - 518, 2015-10


Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers

김준모; 이태익; 조우성; 조민수; 김택수researcher, MPC2018 Fall Conference, 대한용접·접합학회, 2018-10-24


Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate

Kim, CG; Lee, T; Kim, MS; Kim, Taek-Sooresearcher, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14


Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Sooresearcher, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06


Warpage analysis of electroplated Cu films on polymer based packaging core substrate

김철규; 이태익; 김민성; 김택수researcher, MPC2014 Autumn Symposium, MPC, 2014-10-14


Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07


Warpage behavior of chip-on-flex(COF) package under thermal cycling condition

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bokresearcher, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11


Warpage prediction of chip package using simplified model of PCB substrate = PCB 기판의 단순화 모델을 통한 칩 패키지의 휨 예측link

Kim, Junmo; Kim, Taek-Soo; et al, 한국과학기술원, 2019


Warped dipole completed, with a tower of Higgs bosons

Agashe, Kaustubh; Azatov, Aleksandr; Cui, Yanou; Randall, Lisa; Son, Minhoresearcher, JOURNAL OF HIGH ENERGY PHYSICS, no.6, 2015-06


Warped Extra Dimensional Benchmarks for Snowmass 2013

Lee, SeungJoonresearcher, Snowmass Energy Frontier Workshop, University of Washington, Seattle, USA, 2013-07-02



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