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Showing results 172621 to 172640 of 225234

172621

Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30

172622

Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs)

Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01

172623

Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wookresearcher, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27

172624

Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wookresearcher, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

172625

Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

Paik, Kyung-Wookresearcher; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 2007-01-15

172626

Wafer level packages using anisotropic conductive adhesive for flip chip assembly = 이방성 전도성 접착제 용액을 이용한 웨이퍼 레벨 패키지에 관한 연구link

Kim, Il; 김일; et al, 한국과학기술원, 2008

172627

Wafer polishing performance of silica slurries with silica particles grown by sol-gel method

Bae, SH; So, JH; Yang, Seung-Manresearcher; Kim, DH, Material Research Society 2000 Spring Meeting, 2000

172628

Wafer Surface Scanner를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정

배귀남; 박승오researcher; 이춘식; 명현국; 신흥태, 설비공학논문집, v.5, no.2, pp.130 - 140, 1993-05

172629

Wafer temperature simulation and control algorithm in RTA system

조병진researcher; Kim, KT; Kim, CK, Conf. on CAD, Semiconductor Material and Components, pp.0 - 0, 1987-05-12

172630

Wafer to wafer bonding using electroplated Co-Sn solder layer

Kim, SH; Yu, Jinresearcher, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 2008-10-22

172631

Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

172632

Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wookresearcher; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07

172633

Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05

172634

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection

Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11

172635

Wafer-level packaging for MEMS devices with nanoporous materials = 나노 크기의 기공을 갖는 물질을 이용한 MEMS 소자의 웨이퍼 레벨 패키징에 관한 연구link

Lee, Byung-Kee; 이병기; et al, 한국과학기술원, 2010

172636

Wafer-scale controlled Au/Pt bimetallic flowerlike structure array

Huang, Xing-Jiu; Kim, Ju-Hyun; Choi, Yang-Kyuresearcher, GOLD BULLETIN, v.41, no.1, pp.58 - 65, 2008-04

172637

Wafer-scale crack-free AlGaN on GaN through two-step selective-area growth for optically pumped stimulated emission

Ko, Young-Ho; Bae, Sung-Bum; Kim, Sung-Bock; Kim, Dong Churl; Leem, Young Ahn; Cho, Yong-Hoonresearcher; Nam, Eun-Soo, JOURNAL OF CRYSTAL GROWTH, v.445, pp.78 - 83, 2016-07

172638

Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks

Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steveresearcher; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum Philip, ACS NANO, v.6, no.1, pp.451 - 458, 2012-01

172639

Wafer-scale Fabrication of 3D Asymmetric Hierarchical Photonic Structures in Nature

Yang, Sung Pyo; Jeong, Ki Hun, ISNIT 2016, ISNIT, 2016-01-13

172640

Wafer-scale fabrication of biodegradable silk-fibroin-based memristors

Kook, Geon; Jeong, Sohyeon; Kim, Mikyung; Lee, Sungwoo; Kim, Hyojung; Choi, Nakwon; Lee, Hyunjoo Jennyresearcher, 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018, pp.86 - 89, Institute of Electrical and Electronics Engineers Inc., 2018-01-22

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