Showing results 200121 to 200140 of 275594
Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films Lee, I.; Lee, J.; Ko, Seung Hwan; Kim, Taek-Soo, 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging (EMAP), 2013-10-06 |
Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films 이인화; 김택수, 마이크로전자 및 패키징학회지, v.21, no.1, pp.41 - 44, 2014-03 |
Thermal Behavior Analysis of TDLAS Sensor under Wall Heat Flux of Scramjet Intake Kim, Gyeongrok; Shim, HanSeul; Jung, Sion; Min, Tae-Hong; PARK, GISU, The 34th International Symposium on Shock Waves, National Symposium on Shock Waves Korea, 2023-07-18 |
Thermal behavior of alkali-activated fly ash/slag with the addition of an aerogel as an aggregate replacement Seo, Joonho; Bae, S. J.; Jang, DaeIk; Park, Solmoi; Yang, Beomjoo; Lee, Haeng-Ki, CEMENT & CONCRETE COMPOSITES, v.106, pp.103462, 2020-02 |
Thermal Behavior of Boronsilicate Molecular Sieve Woo, Seong-Ihl; Hong, SB; Lee, JK; Uh, YS, Korea Chemical Society Fall Symposium, Korea Chemical Society, 1987 |
Thermal behavior of crosslinked gelatin with poly(N-isopropylacrylamide) grafts Kang, HS; Kim, BY; Kim, Jong-Duk, The 10th Symposium on Chemical Engineering Taejeon/Chungnam-Kyushu, pp.0 - 0, 1997-11-01 |
Thermal behavior of semifluoronated smectic liquid crystals 윤동기; 김대석; 오성대; 김윤호, 2013 춘계학술대회 한국고분자학회, 한국고분자학회, 2013-04-12 |
Thermal behavior of Sn nanowires for nano-interconnection Shin, H; Song, J; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
Thermal buckling analysis of composite cylindrical panels with embedded SMA wires Lee, H.J.; Lee, Jungju, KSCM Annual Autumn Conference, pp.169 - 173, 1997-11 |
Thermal buckling and acoustic vibration characteristics of the shape memory alloy hybrid composite plate Lee, In; Kim, Eun-Ho; Rim, Mi-Sun, 18th International Congress on Sound and Vibration, International Congress on Sound and Vibration, 2011-07-11 |
Thermal buckling and deformation of aerospace structures and their improvement with shape memory alloys Lee, In; Kim, E.-H; Roh, J.-H, 8th International Congress on Thermal Stresses, pp.65 - 65, 2009-06-02 |
Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi S., 10th International Conference on Composite Structures, v.47, no.40547, pp.695 - 703, 1999-11-15 |
Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi, S, COMPOSITE STRUCTURES, v.47, no.1-4, pp.695 - 703, 1999-12 |
Thermal Buckling Characteristics of Composite Conical Shell Structures Woo, Ji-Hye; Rho, Jin-Ho; Lee, In, KSAS INTERNATIONAL JOURNAL, v.8, no.2, pp.82 - 88, 2007-11 |
Thermal buckling of composite beam with embedded shape memory alloy actuators Lee, Jungju, Proceeding of ICCM, pp.0 - 0, ICCM, 1999-07-05 |
Thermal buckling of laminated composite beams with embedded shape memory alloy actuators Choi, S; Lee, Jungju; Lee, DC, JOURNAL OF COMPOSITE MATERIALS, v.34, no.18, pp.1529 - 1547, 2000 |
THERMAL C-O BOND SCISSION IN A MU-3-ETA-2-COORDINATED ACYL - STRUCTURAL CHARACTERIZATION OF A DOUBLY BRIDGING 4-ELECTRON OXO LIGAND SHAPLEY, JR; Park, Joon Taik; CHURCHILL, MR; ZILLER, JW; BEANAN, LR, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.106, no.4, pp.1144 - 1145, 1984 |
Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
Thermal characteristics of composite sandwich structures for machine tool moving body applications Do Suh, J; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.429 - 438, 2004-10 |
Thermal characteristics of conduction cooled 600 kJ HTS SMES system Kim, S; Sim, K; Kim, HJ; Bae, JH; Lee, EY; Seong, KC; Jeong, Sangkwon, CRYOGENICS, v.49, pp.294 - 298, 2009-06 |
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