Browse by Subject wafer bonding

Showing results 1 to 9 of 9

1
Effects of Back Metal on the DC and RF Characteristics of 3D Stacked InGaAs RF Device for Monolithic 3D RF Applications

Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, IEEE ELECTRON DEVICE LETTERS, v.44, no.4, pp.598 - 601, 2023-04

2
Epitaxial Lift-Off Technology for Large Size III-V-on-Insulator Substrate

Lee, Subin; Kim, Seongkwang; Han, Jae-Hoon; Song, Jin Dong; Jun, Dong-Hwan; Kim, Sang-Hyeon, IEEE ELECTRON DEVICE LETTERS, v.40, no.11, pp.1732 - 1735, 2019-11

3
Heterogeneous 3-D Sequential CFETs With Ge (110) Nanosheet p-FETs on Si (100) Bulk n-FETs

Kim, Seong Kwang; Lim, Hyeong-Rak; Jeong, Jaejoong; Lee, Seung Woo; Jeong, Ho Jin; Park, Juhyuk; Kim, Joon Pyo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.71, no.1, pp.393 - 399, 2024-01

4
Heterogeneous and Monolithic 3D Integration Technology for Mixed-Signal ICs

Jeong, Jaeyong; Geum, Dae-Myeong; Kim, SangHyeon, ELECTRONICS, v.11, no.19, 2022-10

5
Impact of Bottom-Gate Biasing on Implant-Free Junctionless Ge-on- Insulator n-MOSFETs

Lim, Hyeong-Rak; Kim, Seongkwang; Han, Jae-Hoon; Kim, Hansung; Geum, Dae-Myeong; Lee, Yun-Joong; Ju, Byeong-Kwon; et al, IEEE ELECTRON DEVICE LETTERS, v.40, no.9, pp.1362 - 1365, 2019-09

6
Nanofluidic chip for liquid TEM cell fabricated by parylene and silicon nitride direct bonding

Jang, Heejun; Kang, Il-Suk; Kim, Jihye; Kim, Jonghyun; Cha, Yun Jeong; Yoon, Dong Ki; Lee, Wonhee, NANOTECHNOLOGY, v.28, no.37, pp.1361 - 6528, 2017-09

7
Photo-Responsible Synapse Using Ge Synaptic Transistors and GaAs Photodetectors

Kim, Seong Kwang; Geum, Dae-Myeong; Lim, Hyeong-Rak; Han, JaeHoon; Kim, Hyungjun; Jeong, YeonJoo; Kim, Sang-Hyeon, IEEE ELECTRON DEVICE LETTERS, v.41, no.4, pp.605 - 608, 2020-04

8
Stackable InGaAs-on-Insulator HEMTs for Monolithic 3-D Integration

Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Park, Juyeong; Jang, Jae-Hyung; Kim, Sanghyeon, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.68, no.5, pp.2205 - 2211, 2021-05

9
실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구 = A study on the Co-Sn IMCs for the silicon wafer bondinglink

김성환; Kim, Sung-Hwan; et al, 한국과학기술원, 2008

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