Browse by Subject wafer bonding

Showing results 1 to 4 of 4

Epitaxial Lift-Off Technology for Large Size III-V-on-Insulator Substrate

Lee, Subin; Kim, Seongkwang; Han, Jae-Hoon; Song, Jin Dong; Jun, Dong-Hwan; Kim, Sang-Hyeonresearcher, IEEE ELECTRON DEVICE LETTERS, v.40, no.11, pp.1732 - 1735, 2019-11

Impact of Bottom-Gate Biasing on Implant-Free Junctionless Ge-on- Insulator n-MOSFETs

Lim, Hyeong-Rak; Kim, Seongkwang; Han, Jae-Hoon; Kim, Hansung; Geum, Dae-Myeong; Lee, Yun-Joong; Ju, Byeong-Kwon; et al, IEEE ELECTRON DEVICE LETTERS, v.40, no.9, pp.1362 - 1365, 2019-09

Nanofluidic chip for liquid TEM cell fabricated by parylene and silicon nitride direct bonding

Jang, Heejun; Kang, Il-Suk; Kim, Jihye; Kim, Jonghyun; Cha, Yun Jeong; Yoon, Dong Kiresearcher; Lee, Wonheeresearcher, NANOTECHNOLOGY, v.28, no.37, pp.1361 - 6528, 2017-09

실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구 = A study on the Co-Sn IMCs for the silicon wafer bondinglink

김성환; Kim, Sung-Hwan; et al, 한국과학기술원, 2008



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