Browse by Subject printed circuit board (PCB)

Showing results 1 to 7 of 7

A low-cost high-efficiency CCFL inverter with new capacitive sensing and control

Kim, SK; Han, HS; Woo, YJ; Cho, Gyu-Hyeongresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.21, pp.1444 - 1451, 2006-09

An EMI Evaluation Method for Integrated Circuits in Mobile Devices

Park, Hyun Ho; Jang, Hyun-Tae; Park, Hark-Byeong; Choi, Cheolseung, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.4, pp.780 - 787, 2013-08

High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling

Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoungresearcher; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07

Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

Cho, Jeonghyeon; Song, Eak-Hwan; Kim, Hee-Gon; Ahn, Seung-Youngresearcher; Pak, Jun-So; Kim, Ji-Seong; Kim, Joung-Horesearcher, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.3, pp.814 - 822, 2011-08

Modeling and measurement of simultaneous switching noise coupling through signal via transition

Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Li, Er-Ping; Wei, Xing-Chang; Cangellaris, Andreas C; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, Marcello; Kim, Jounghoresearcher; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.248 - 265, 2010-05

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Youngresearcher; Kim, Joung-Horesearcher, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04



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