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Showing results 1 to 3 of 3

1
A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

Zhang, Shuye; Lin, Tiesong; He, Peng; Zhao, Ning; Huang, Mingliang; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12

2
Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates

Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.24, no.1, pp.24 - 32, 2001-03

3
Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film

Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07

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