Browse by Subject hybrid integrated circuit bonding

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Compact packaging of optical and electronic components for on-board optical interconnects

Cho, HS; Chu, KM; Kang, S; Hwang, SH; Rho, BS; Kim, WH; Kim, JS; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.1, pp.114 - 120, 2005-02

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