Browse by Subject curvature
Showing results 1 to 12 of 12
| Development of a cold incremental rolling process using a line array roll set for the manufacture of doubly curved metal plates = 이중 곡률의 금속 판재 성형을 위한 선형 배열 롤 셋을 이용한 냉간 점진적 롤 성형 공정 개발link Shim, Do-Sik; 심도식; et al, 한국과학기술원, 2010 |
| Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01 |
| Haptic Rendering of 3D Geometry on 2D Touch Surface Based on Mechanical Rotation Kim, Seung-Chan; Han, Byungkil; Kwon, Dong-Soo, IEEE TRANSACTIONS ON HAPTICS, v.11, no.1, pp.140 - 145, 2018-01 |
| Helical extension method for solving the natural equation of a space curve Lim, Sungyeop; Han, Soonhung, SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES, v.5, no.3, 2017-09 |
| Local influence in maximum likelihood factor analysis Jung, KM; Kim, MG; Kim, Byung-Chun, COMPUTATIONAL STATISTICS DATA ANALYSIS, v.24, no.4, pp.483 - 491, 1997-06 |
| Methodology development of packaging substrate warpage analysis = 패키징 기판의 휨 분석 방법 개발link Kim, Cheol-Gyu; 김철규; et al, 한국과학기술원, 2014 |
| Polyimide 위에 스퍼터 증착한 Cu 및 Cr 박막의 잔류응력에 관한 연구 = A study on the residual stress of sputter-deposited Cu and Cr thin films on polyimidelink 조성일; Cho, Sung-Il; et al, 한국과학기술원, 2001 |
| Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08 |
| Residual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain Cuddalorepatta, Gayatri K.; Sim, Gi-Dong; Li, Han; Pantuso, Daniel; Vlassak, Joost J., JOURNAL OF MATERIALS RESEARCH, v.34, no.20, pp.3474 - 3482, 2019-10 |
| Segmentation of measured point data using a parametric quadric surface approximation Yang, Min-Yang; Lee, E, COMPUTER-AIDED DESIGN, v.31, no.7, pp.449 - 457, 1999-06 |
| Smooth surface extension with curvature bound Kim, H; Oh, Seungtaik; Yim, JW, COMPUTER AIDED GEOMETRIC DESIGN, v.22, no.1, pp.27 - 43, 2005-01 |
| 제한된 곡률을 갖는 최단경로에 대한 기하학적 증명 정지원; 안희갑; 배상원, 정보과학회논문지 : 시스템 및 이론, v.34, no.4, pp.132 - 137, 2007-04 |
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