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A unified RLC model for high-speed on-chip interconnects Sim, SP; Krishnan, S; Petranovic, DM; Arora, ND; Lee, Kwyro; Yang, CY, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.50, pp.1501 - 1510, 2003-06 |
An ASIC design for versatile receive front-end electronics of an ultrasonic medical imaging system - 16 channel analog inputs and 4 dynamically focused beam outputs Park, SB; Kwak, J; Lee, Kwyro, ULTRASONIC IMAGING, v.25, pp.85 - 108, 2003-04 |
Highly Conductive Tungsten Thin Films Prepared by the Plasma-Assisted Silane Reduction Process Y.T.Kim; S.K.Min; J.S.Hong; Kim, Choong Ki, JAPANESE JOURNAL OF APPLIED PHYSICS, v.30, no.4, pp.820 - 826, 1991-04 |
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