Browse by Subject UBM (under bump metallurgy)

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Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems

Jang, SY; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.24, no.4, pp.269 - 274, 2001-10

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