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Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

Lee, Dongju; Lee, Seyong; Byun, Segi; Paik, Kyung-Wookresearcher; Song, Sung Ho, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.107, pp.217 - 223, 2018-04

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