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Showing results 1 to 4 of 4

1
A new one-point quadrature enhanced assumed strain (EAS) solid-shell element with multiple integration points along thickness: Part I - geometrically linear applications

de Sousa, Ricardo J. Alves; Cardoso, Rui P.R.; Valente, Robertt A. Fontes; Yoon, Jeong Whan; Gracio, José J; Jorge, Renato M. Natal, INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, v.62, no.7, pp.952 - 977, 2005-02

2
Contact analysis of mechanically fastened joints in composite laminates by linear complementarity problem formulation

Ko, HY; Kwak, Byung Man, COMPOSITE STRUCTURES, v.40, no.3-4, pp.187 - 200, 1997-12

3
Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method

Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005

4
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

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