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Showing results 1 to 5 of 5

1
Automated detection of delamination and disbond from wavefield images obtained using a scanning laser vibrometer

Sohn, Hoon; Dutta, D; Yang, JY; DeSimio, M; Olson, S; Swenson, E, SMART MATERIALS STRUCTURES, v.20, no.4, 2011-04

2
Complete noncontact laser ultrasonic imaging for automated crack visualization in a plate

An, Yun-Kyu; Park, Byeongjin; Sohn, Hoon, SMART MATERIALS AND STRUCTURES, v.22, no.2, 2013-02

3
Delamination detection in composites through guided wave field image processing

Sohn, Hoon; Dutta, D; Yang, Jin-Yeol; Park, Hyun-Jun; DeSimio, M; Olson, S; Swenson, E, COMPOSITES SCIENCE AND TECHNOLOGY, v.71, no.9, pp.1250 - 1256, 2011-06

4
Flash Light Millisecond Self-Assembly of High chi Block Copolymers for Wafer-Scale Sub-10 nm Nanopatterning

Jin, Hyeong Min; Park, Dae Yong; Jeong, Seong-Jun; Lee, Gil Yong; Kim, Ju Young; Mun, Jeong Ho; Cha, Seung Keun; et al, ADVANCED MATERIALS, v.29, no.32, 2017-08

5
Hot target inspection using a welded fibre acoustic wave piezoelectric sensor and a laser-ultrasonic mirror scanner

Chia, Chen Ciang; Lee, Jung-Ryul; Shin, He-Jin, MEASUREMENT SCIENCE & TECHNOLOGY, v.20, no.12, 2009-12

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