Showing results 1 to 2 of 2
Effects of Curing Agent and Curing Temperature on Material Properties of Epoxy/BaTiO3 Composite Embedded Capacitor Films Lee, Hyeong Gi; Paik, Kyung-Wook, IEEE Transactions on Components Packaging and Manufacturing Technology, v.5, no.4, pp.451 - 459, 2015-04 |
Studies on solder bumps coining processes and reliability of assembled flip chip = 솔더 범프 코이닝 공정 및 플립칩 접속 후 신뢰성에 관한 연구link Nah, Jae-Woong; 나재웅; et al, 한국과학기술원, 2004 |
Discover