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1

Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint

Kim, JH; Jeong, SW; Kim, HD; Lee, HyuckMoresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1228 - 1234, 2003-11

2

액상 Au-Sn 솔더와 Ni 기판의 계면현상에 대한 고찰

김종훈; 정상원; 이혁모researcher; 김성수, Journal of the Microelectronics and Packaging Society, v.11, no.3, pp.47 - 53, 2004-09

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