Showing results 1 to 6 of 6
An improved criterion to minimize FE mesh-dependency in concrete structures under high strain rate conditions Kwak, Hyo-Gyoung; Gang, HanGul, INTERNATIONAL JOURNAL OF IMPACT ENGINEERING, v.86, pp.84 - 95, 2015-12 |
Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
Analysis of the T-peel strength in a Cu/Cr/polyimide system Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09 |
Modeling of a Gc-sensing element for the interfacial toughness of metal thin films on substrates Jeon I.; Asahina T.; Omiya M.; Kishimoto K.; Im, Seyoung, SENSORS AND ACTUATORS A-PHYSICAL, v.122, no.2, pp.291 - 300, 2005-08 |
Phase angle in the Cu/polyimide/alumina system Park, YB; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.109 - 114, 1999-06 |
Role of Crack Deflection on Rate Dependent Mechanical Transfer of Multilayer Graphene and Its Application to Transparent Electrodes Kang, Sumin; Yoon, Taeshik; Kim, Seunghwan; Kim, Taek-Soo, ACS APPLIED NANO MATERIALS, v.2, no.4, pp.1980 - 1985, 2019-04 |
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