Browse by Subject 80Sn-20Pb
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| Effects of Plating Conditions on the Microstructure of 80Sn-20Pb Electrodeposits from an Organic Sulfonate Bath Kwon, Hyuk-Sang, SURFACE AND COATINGS TECHNOLOGY, v.78, no.1-3, pp.56 - 63, 1996-01 |
| Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90 degrees-bending Suh, MS; Kwon, Hyuk-Sang, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.10, pp.6067 - 6073, 2000-10 |
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