Browse by Subject (Au,Ni)(3)Sn-2 grains

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Microstructural evolution of joint interface between eutectic 80Au-20Sn solder and UBM

Kim, SS; Kim, JH; Booh, SW; Kim, TG; Lee, HyuckMoresearcher, MATERIALS TRANSACTIONS, v.46, no.11, pp.2400 - 2405, 2005-11

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