Browse by Subject SiP

Showing results 1 to 9 of 9

1
60 GHz monolithic SiP transmitter integrating MMICs on LTCC multilayer circuits = LTCC 다층회로에 MMICs를 집적한 60 GHz monolithic SiP 송신기link

Lee, Young-Chul; 이영철; et al, 한국정보통신대학교, 2005

2
A very compact 62-GHz transmitter LTCC SiP module for wireless terminals applications

Lee, YC; Park, Chul Soon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.49, pp.575 - 578, 2007-03

3
Design and analysis of low-noise and low-power system-in-package (SiP) for Non-coherent Ultra Wide-Band (UWB) transceiver based on system model consisting of chip-package-PCB = 칩,패키지,PCB로 구성된 시스템모델을 바탕으로 비동기식 초광대역(UWB) 송수신기를 위한 저잡음, 저전력 SiP의 설계 및 분석link

Yoon, Chang-Wook; 윤창욱; et al, 한국과학기술원, 2010

4
Design of a low-noise UWB transceiver SiP

Yoon, CW; Park, YJ; Lee, JW; Park, HJ; Kim, JM; Pak, JS; Kim, Joungho, IEEE DESIGN & TEST OF COMPUTERS, v.25, pp.18 - 28, 2008-01

5
Effects of electroplating parameters on the defects of copper via for 3D SiP

Cho, Byeong-Hoon; Lee, Won-Jong; Lee, Jae-Ho, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 1, pp.49 - 52, 2007-06

6
LTCC-based monolithic system-in-package (SiP) module for millimeter-wave applications

Lee, Young Chul; Park, Chul Soon, INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, v.26, no.9, pp.803 - 811, 2016-11

7
Noise isolation design, analysis, and verification of T-DMB stacked SiP = T-DMB 적층형 시스템-인-패키지에서의 잡음격리설계와 분석 및 검증link

Ha, Myung-Hyun; 하명현; et al, 한국과학기술원, 2007

8
Proposed design methodologies of mixed-signal 3D system-in-package for enhanced noise isolation and application to T-DMB system = 향상된 잡음 격리를 위한 혼성신호 3D 시스템-인-패키지 설계 방법론과 T-DMB 시스템에의 적용link

Park, Ji-Woo; 박지우; et al, 한국과학기술원, 2009

9
Wideband narrow pitch via electromagnetic bandgap structure for suppression of P/G noise coupling to signal in SiP = 시스템 인 패키지에서 전력접지 잡음의 신호선 전달을 억제하기 위한 좁은 간격 비아를 이용한 광대역 EBG 구조link

Hwang, Chul-Soon; 황철순; et al, 한국과학기술원, 2009

rss_1.0 rss_2.0 atom_1.0