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Showing results 1 to 6 of 6

1
Crystalline structure and Cu diffusion barrier property of Ta-Si-N films | [Ta-Si-N Korean source]

Jung, Byoung-Hyo; Lee, Won-Jong, KOREAN JOURNAL OF MATERIALS RESEARCH, v.21, no.2, pp.95 - 99, 2011-02

2
DNA-Templated Metallization for Formation of Porous and Hollow Silver-Shells

Lee, Jungkyu K.; Kim, Mi Rae; Choi, Insung; Jung, Young Hwan; Kim, Yang-Gyun, BULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.34, no.3, pp.986 - 988, 2013-03

3
Electrical characteristics and detailed interfacial structures of Ag/Ni metallization on polycrystalline thermoelectric SnSe

Kim, Yeongseon; Jin, Younghwan; Yoon, Giwan; Chung, In; Yoon, Hana; Yoo, Chung-Yul; Park, Sang Hyun, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.35, no.5, pp.711 - 718, 2019-05

4
Multi-Layer Metallization Structure Development for Highly Efficient Polycrystalline SnSe Thermoelectric Devices

Kim, Yeongseon; Yoon, Gi-Wan; Cho, Byung-Jin; Park, Sang Hyun, APPLIED SCIENCES, v.7, no.11, 2017-11

5
Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices

Song, Jinseop; Kim, Yeongseon; Cho, Byung Jin; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03

6
구리확산방지막용 질화텅스텐 박막의 열적 안정성과 미세구조 = Thermal stabilities and microstructures of $WN_x$ films as a Cu diffusion barrierlink

서봉석; Suh, Bong-Seok; et al, 한국과학기술원, 2000

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