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Showing results 1 to 4 of 4

1
Barrier properties and failure mechanism of Ta-Si-N thin films for Cu interconnection

Lee, YJ; Suh, BS; Kwon, MS; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.85, no.3, pp.1927 - 1934, 1999-02

2
Co-sputter deposited Ta-Si diffusion barrier between Si and Cu: the effects of Si content on the barrier property

Lee, YJ; Suh, BS; Park, Chong-Ook, THIN SOLID FILMS, v.357, no.2, pp.237 - 241, 1999-12

3
Structural and chemical stability of Ta-Si-N thin film between Si and Cu

Lee, YJ; Suh, BS; Rha, SK; Park, Chong-Ook, THIN SOLID FILMS, v.320, no.1, pp.141 - 146, 1998-05

4
The Mechanism of Si Incorporation and the Digital Control of Si Content during the Metallorganic Atomic Layer Deposition of Ti-Si-N Thin Films

Min, Jae-Sik; Park, Jin-Seong; Park, Hyung-Sang; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.147, no.10, pp.3868 - 3872, 2000-06

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