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Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sungwoo; Lee, Jin Hee; Lee, Woong-Sun; Kim, Taek-Soo, POLYMER TESTING, v.125, 2023-08 |
리드프레임과 EMC의 접착에 관한 연구 = A study on the adhesion of leadframe to EMClink 이호영; Lee, Ho-Young; et al, 한국과학기술원, 1999 |
이온처리된 리드프레임과 EMC와의 접착특성 연구 = A study on adhesion characteristics between Ion-treated leadframe and epoxy molding compoundlink 한훈; Han, Hun; et al, 한국과학기술원, 1997 |
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