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Showing results 26 to 35 of 35

26
Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps

Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11

27
Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films

Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02

28
Study on the characteristics of aluminuim thin films prepared by atomic layer deposition

Sang-Won Kang, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, v.20, no.6, pp.1983 - 1988, 2002-11

29
Study on the effects of copper oxide growth on the peel strength of copper/polyimide

Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08

30
Surface morphology improvement of metalorganic chemical vapor deposition Al films by layered deposition of Al and ultrathin TiN

Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, JAPANESE JOURNAL OF APPLIED PHYSICS, v.39, no.6A, pp.3349 - 3354, 2000-06

31
Texture and sheet resistance of Al alloy thin films on Ti and TiN thin films

Lee, WJ; Kim, SJ; Lee, WH; Lee, YJ; Lee, YS; Rha, SK; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.15, no.1, pp.9 - 13, 2004-01

32
THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION

Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09

33
TiN barrier layer formation by the two-step rapid thermal conversion process

Kim, YT; Jun, CH; Lee, JH; Baek, JT; Joun, H; Yoo, Hyung Joun, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.14, no.6, pp.3245 - 3251, 1996

34
Transformer coupled plasma enhanced metal organic chemical vapor deposition of Ta(Si)N thin films and their Cu diffusion barrier properties

Park, HL; Byun, KM; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, no.10, pp.6153 - 6164, 2002-10

35
Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints

Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.7, pp.889 - 895, 2011-04

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