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Showing results 167241 to 167260 of 276015
| Reliability Assessment of Advanced Materials and Structures Lee, Soon-Bok, JOURNAL OF SOLID MECHANICS AND MATERIALS ENGINEERING, v.4, no.6, pp.639 - 651, 2010-07 |
| Reliability assessment of BGA solder joints under cyclic bending loads Kim, Ilho; Lee, Soon-Bok, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.27 - 32, 2005-12-11 |
| Reliability Assessment of Electronic Packaging and Thin Film Lee Soon-Bok, ICMR2011(International Conference on Materials Reliability 2011), KSME, 2011-11 |
| Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics Lee, Soon-Bok; Kim, Ilho, APCOM'07 in conjunction with EPMESC XI, 2011-08-12 |
| Reliability Assessment of Electronics Packaging and Thin Films for Flexible Electronics Lee, Soon-Bok, 2014 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), 2014-07-22 |
| Reliability Assessment of Electronics Packaging with Fringe Pattern Analysis Lee, Soon-Bok; Ham, Suk-Jin, ICEM05, pp.17 -, 2005 |
| Reliability assessment of embedded digital system using multi-state function Choi, JG; Seong, Poong-Hyun, RELIABILITY ENGINEERING & SYSTEM SAFETY, v.91, no.3, pp.261 - 269, 2006-03 |
| RELIABILITY ASSESSMENT OF LEAD-FREE SOLDER JOINTS IN ELECTRONICS PACKAGING Lee, Soon-Bok, UKC 2008, 2008 |
| Reliability assessment of multiaxial creep and multiaxial fatigue using stochastic modeling = 추계적 모델링을 이용한 다축 크리프 및 다축피로 하의 신뢰도 평가link Lee, Bong-Hoon; 이봉훈; et al, 한국과학기술원, 2002 |
| Reliability assessment of translated VMF/link-16 messages Kim, Jingyu; Kang, Sungwon; Lee, Nohbok, 19th International Symposium on Software Reliability Engineering, ISSRE 2008, pp.283 - 284, 2008-11-10 |
| Reliability assessment on electronic interconnects by S-parameter pattern analysis = S파라미터 패턴 분석을 이용한 전기적 인터커넥트의 신뢰성 평가link Kang, Tae Yeob; Kim, Taek-Soo; et al, 한국과학기술원, 2022 |
| Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods Lee, Soon-Bok; Ham, SJ, Workshop on Flip Chip Packaging, 1999 |
| Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads Kim, IH; Lee, Soon-Bok, 대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, pp.64 - 71, 2006 |
| Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads 이순복, JOURNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY, v.13, no.1, pp.63 - 72, 2006-01 |
| Reliability based design optimization for crashworthiness of a spot welded hat type member Kim, Yu Jong; Huh, Hoon, 8th World Congress on Structural and Multidisciplinary Optimization, WCSMO8, 2009-06-01 |
| Reliability based design optimization of a flexible wing Kwon, Jang-Hyuk, The Asian CFD Society, pp.0 - 0, The Asian CFD Society, 2005-10 |
| Reliability based design optimization using the response surface augmented moment method Kwak, Byung Man, World Congress on Structural and Multidisciplinary Optimization, pp.102 -, 2005 |
| Reliability based multi-disciplinary design optimization Kwon, Jang-Hyuk, KSEA-KOFST-KUSCO, pp.0 - 0, 2005-08 |
| Reliability Based Optimal Design Using POD Technique KWAK BYUNG MAN, pp.66 - 79, 1987-05-01 |
| Reliability based real-time slope stability assessment 이승래; 최정찬, KGS fall national conference 2008, 2008 |
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- 31,027 2020 - 2024
- 99,969 2010 - 2019
- 75,670 2000 - 2009
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- 62 1964 - 1969